Semiconductor film removal inspection, wafer and TFT crack detection, CCD alignment and custom PC/PLC development. Start with your process and build an inspection approach that can be validated.
Match the inspection method to the material, imaging conditions and acceptance criteria. Combine measurable AOI rules with AI where sample learning adds value.
Evaluate residual film, incomplete peeling, ROI-based area analysis and OK/NG classification for semiconductor film removal inspection.
Evaluate mark, hole and edge localization, X/Y offsets, angular deviation, camera calibration and equipment compensation interfaces.
Evaluate micron-scale visible cracks, edge chips, corner loss and broken parts in wafer, die and TFT inspection workflows.
Evaluate visible defects on TFT-LCD panels, glass and films, including cracks, scratches, particles, edge chips and placement offsets.
Connect inspection algorithms, operator interfaces and PLC handshakes, with MQTT and SECS communication tailored to equipment and host requirements.
Explore custom development ↗Detection capability, minimum size, accuracy and cycle time are confirmed through sample validation.
Application imagery connects defect visibility with practical inspection and alignment requirements.
Evaluate visible cracks, chips, missing corners and broken parts in wafer, die and TFT workflows.
VISION ALIGNMENTCompare reference positions and plan X/Y and angular compensation.
Explore application ↗
OK SAMPLEEvaluate removal completeness with ROI and area analysis.
Explore application ↗
NG SAMPLEAssess visible residual film and incomplete peeling.
Explore application ↗Film images are blurred to protect details and parameters. Application images do not establish a universal detection limit, accuracy or throughput.
Understand the material before choosing the optics and decision method.
Evaluate my application ↗Evaluate film removal, visible cracks, edge chips, reference localization and position offsets. Trial imaging confirms defect contrast.
Assess scratches, particles, contamination, cracks and edge damage on glass and films. Lit-panel and Mura inspection require separate imaging definitions.
Evaluate lighting for transparent, translucent and reflective surfaces, including edges, missing material and placement differences.
Connect acquisition and inspection to operator interfaces, PLC handshakes, MQTT reporting and SECS host communication.
Combine explainable geometric inspection with sample-based learning for complex appearance differences.
Dimensions, shapes, positions and areas can be evaluated with image processing and geometric measurement, with visible regions and thresholds.
Evaluate classification, detection or segmentation for variable textures and defects, then test false rejects and missed defects on independent samples.
WeiWang's customary PC-based stack connects C#/.NET and Machine Vision with PLC handshakes, MQTT data exchange and SECS host communication.
Manual/automatic modes, recipes, equipment status, alarms and operator records.
Acquisition, ROIs, localization, measurement and defect analysis, with results and image records.
Trigger, Ready/Busy, result acknowledgement and recovery, defined for the actual controller.
Publish/subscribe status and inspection data through MQTT; implement SECS/HSMS messages against the host specification.
MQTT topics, data fields, SECS messages and GEM scope are agreed with the customer. Equipment motion and time-critical handshakes remain part of the control workflow.
Discuss PC-based / MQTT / SECS integration ↗Agree on defects, acceptance limits, field of view and line timing.
Use good, defective and borderline samples to establish visible contrast.
Check false rejects, missed defects, repeatability and processing time.
Define interfaces, error handling, traceability and acceptance testing.
Clear scope makes the technical discussion more productive.
Visible residual film, cracks, edge chips, missing corners, scratches and position deviations can be assessed according to the material and imaging setup.
Define the smallest defect dimension and required detection performance. Pixel scale alone does not establish detection limits or measurement accuracy.
Share the architecture, available source, interface specification and change scope to evaluate compatibility and a testable implementation plan.
MQTT supports publish/subscribe data exchange for status and inspection reporting. SECS host communication is defined against the customer message specification; HSMS and GEM scope are agreed for the project.
Product details, good and defective samples, defect criteria, field of view, cycle time, camera and PLC models, and interface requirements.
Custom PLC programming and complete machine software development, covering PC-based operator interfaces, manual and automatic operation, equipment sequences, recipe management, alarms, production records and device communication. Integrate AOI inspection triggers, Ready/Busy handshakes, OK/NG results and offset feedback with PLC control, MQTT and SECS/HSMS host communication. Functions, interfaces and acceptance criteria are defined around each machine’s requirements.
Tell us about your material, defects, cycle time or custom equipment-software requirements.
Prepare sample types, defect definitions, field of view, cycle time and interfaces. Contact us before sending confidential files.